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SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park

Abstract editorial illustration for: SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park
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SK hynix broke ground on a $4 billion advanced-packaging fabrication and R&D site for AI memory at Purdue Research Park. The investment could create jobs, bolster U.S. semiconductor supply chains and expand AI hardware capacity. Continue for project timeline, expected employment, funding details and regional economic impact.
Source: Purdue News

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